March
2011
Volume
88
Number
2
Pages
201
—
208
Authors
Melanie Caffe-Treml,1,2
Karl D. Glover,1
Padmanaban G. Krishnan,3
Gary A. Hareland,4
Krishna D. Bondalapati,1 and
Jeff Stein1
Affiliations
Plant Science Department, South Dakota State University, Brookings, SD 57007.
Corresponding author. Phone: 605-633-0003. E-mail: melanie.caffe@sdstate.edu
Department of Health and Nutritional Sciences, South Dakota State University, Brookings, SD 57007.
USDA-ARS Hard Red Spring Wheat Quality Laboratory, Fargo, ND 58501.
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RelatedArticle
Accepted October 13, 2010.
Abstract
ABSTRACT
Dough extensibility affects processing ease, gas retention, and loaf volume of finished products. The Kieffer dough extensibility test was developed to assess extensibility of small dough samples and is therefore adapted for use in breeding programs. Information is lacking on relationships between wheat growing environments and dough properties measured by the Kieffer dough extensibility test. This study documents the variability of dough extensibility (Ext), maximum resistance to extension (Rmax), and area under the extensibility curve (Area) in relation to breadmaking quality, and the effect of wheat growing environments. Mixograph, Kieffer dough extensibility, and bake tests were performed on flour milled from 19 hard red spring wheat (Triticum aestivum L.) genotypes grown during three growing seasons (2007-2009) at six South Dakota locations. Although both genotype and environment had significant effects on Kieffer dough extensibility variables, environment represented the largest source of variation. Among genotype means, Area was most correlated (r = 0.63) with loaf volume, suggesting that by selecting lines with increased Area, loaf volume should improve. Rmax was positively correlated (r = 0.58) with loaf volume among genotype means but negatively correlated (r = –0.80) among environmental means. Ext was positively correlated (r = 0.90) with loaf volume among environmental means. Weather variables were correlated with Rmax, Ext and loaf volume and therefore could help predict end-use quality.
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